Multi-die temperature control device and method for controlling temperature of multi-die power module
AssigneeMitsubishi Electric Corporation
InventorsJeffrey Ewanchuk, Julio Brandelero
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AssigneeMitsubishi Electric Corporation
InventorsJeffrey Ewanchuk, Julio Brandelero
Estimating the term…
The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.
A method for controlling temperature of a multi-die power module comprising plural dies, a multi-die temperature control device receiving an input signal and driving independently the dies of the multi-die power module, wherein the method is executed by the multi-die temperature control device and comprises the steps of:
A multi-die temperature control device that controls temperature of a multi-die power module including plural dies, the multi-die temperature control device receiving an input signal and driving independently the dies of the multi-die power module, the multi-die temperature control device comprising:
Dependencies are inferred from the claim text.