Electronic device including heat dissipation structure

An electronic device comprising:

• a housing comprising a plurality of acoustic holes;
• an enclosure mounted in the housing;
• at least one heating element disposed in the enclosure;
• a heat dissipation structure disposed on the at least one heating element to transfer heat generated from the at least one heating element;
• and
• a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring heat from the heat dissipation structure to outside the housing through the plurality of acoustic holes,
• wherein the heat dissipation structure comprises:
• at least one first heat transfer member coupled to the at least one heating element;
• and
• a second heat transfer member disposed at least partially on the at least one first heat transfer member to transfer, to the heat dissipation duct, heat from the first heat transfer member,
• wherein the at least one heating element comprises:
• a power supply disposed in the enclosure;
• and
• at least one substrate disposed adjacent to the power supply, and
• wherein the at least one first heat transfer member comprises:
• one end portion, which is disposed in a substantially horizontal state, in contact with the at least one substrate;
• another end portion, which is disposed in a substantially horizontal state, having a gap with respect to an upper face of the power supply;
• and
• a connection portion, which is disposed in a substantially vertical state, bent at each of the one end portion and the other end portion, and having a gap with respect to a side face of the power supply.