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US 11,388,839 B2Granted
Power electronics cooling assemblies and methods for making the same
AssigneesToyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
InventorsFeng Zhou, Shohei Nagai
Life of this patent
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Abstract
A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.
Claims18
A power electronics module comprising:
- a cold plate manifold;
- a heat sink base layer at least partially embedded in the cold plate manifold;
- an electrically-insulating layer in direct contact with the heat sink base layer;
- a conductive substrate positioned on the electrically-insulating layer;
- a power electronics device coupled to and in direct contact with the conductive substrate;
- and
- a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device.
4 more elements
A method for forming a power electronics module, the method comprising:
- positioning a conductive substrate over and in direct contact with a first surface of an electrically-insulating layer;
- positioning a heat sink base layer over and in direct contact with a second surface of the electrically-insulating layer opposite the conductive substrate;
- coupling a power electronics device to the conductive substrate such that the power electronics device is in direct contact with the conductive substrate;
- pressing the heat sink base layer into a plastic cold plate manifold;
- heating the heat sink base layer, thereby melting at least a portion of the plastic cold plate manifold to couple the heat sink base layer to the plastic cold plate manifold such that the heat sink base layer is at least partially embedded in the cold plate manifold;
- and
- positioning a printed circuit board layer over the power electronics device and the conductive substrate such that the printed circuit board layer at least partially encapsulating the power electronics device.
4 more elements
A power electronics module comprising:
- a cold plate manifold structurally configured to dissipate thermal energy;
- a heat sink base layer directly bonded to the cold plate manifold;
- an electrically-insulating layer in direct contact with the heat sink base layer;
- a conductive substrate positioned on and in direct contact with the electrically-insulating layer;
- a power electronics device positioned on and in direct contact with the conductive substrate;
- a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device;
- and
- a driver circuit component positioned on a surface of the printed circuit board layer.
5 more elements
Dependencies are inferred from the claim text.