Back to results
US 11,388,824 B2Granted
Component carrier having a three dimensionally printed wiring structure
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMarco Gavagnin, Markus Leitgeb, Jonathan Silvano de Sousa, Ferdinand Lutschounig
Life of this patent
Estimating the term…
Abstract
A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.
Claims16
A component carrier, comprising:
- a carrier body comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure which layer structures are stacked above each other in a stacking direction;
- and
- a wiring structure being at least partially formed as a three-dimensionally printed structure,
- wherein one of the plurality of electrically conductive layer structures comprises a conductive foil formed on an external surface of the at least one electrically insulating layer structure of the carrier body such that the conductive foil covers the wiring structure;
- wherein the wiring structure is formed on the conductive foil
- and extends from the conductive foil into the carrier body such that the wiring structure is laterally enclosed by the at least one electrically insulating layer structure,
- wherein the wiring structure has a varying height in the stacking direction,
- wherein the wiring structure comprises a powder material.
5 more elements
A method of manufacturing a component carrier, comprising:
- providing a carrier body comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure;
- forming a wiring structure at least partially by three-dimensionally printing;
- and
- forming a conductive foil on at least one external surface of the at least one electrically insulating layer structure of the carrier body such that the conductive foil covers the wiring structure;
- wherein the wiring structure extends from the conductive foil into the carrier body such that the wiring structure is enclosed by the at least one electrically insulating layer structure and has a varying height in the stacking direction,
- wherein the wiring structure comprises a powder material.
3 more elements
Dependencies are inferred from the claim text.