Methods for improved polymer-copper adhesion
AssigneeApplied Materials, Inc.
InventorsTapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Chintan Buch, Prerna Goradia, Giback Park, Kyuil Cho
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Abstract
Methods for forming circuit boards and circuit boards using an adhesion layer are described. A substrate with two surfaces is exposed to a bifunctional organic compound to form an adhesion layer on the first substrate surface. A resin layer is then deposited on the adhesion layer and the exposed substrate surfaces. Portions of the resin layer may be removed to expose metal pads for contacts.
Claims20
A method of forming a circuit board, the method comprising:
- exposing a substrate having a first substrate surface and a second substrate surface to a bifunctional organic compound to form an adhesion layer on the first substrate surface;
- and
- depositing a resin layer on the adhesion layer, the first substrate surface and the second substrate surface.
A method of forming a circuit board, the method comprising:
- exposing a substrate having a copper pad and a dielectric surface to a bifunctional organic compound to form an adhesion layer on the copper pad comprising a monolayer or less of the bifunctional organic compound, the bifunctional organic compound having two different functional groups, one of the functional groups reactive with the copper pad and the other of the functional groups not reactive with the copper pad;
- depositing a resin layer on the adhesion layer, the copper pad and the dielectric surface;
- removing a portion of the resin layer over the copper pad by laser ablation to expose the copper pad through the resin layer;
- and
- curing the resin layer.
A circuit board comprising:
- a surface of a copper pad with a dielectric material surrounding the surface;
- an adhesion layer on the copper pad, the adhesion layer comprising a bifunctional organic compound, the bifunctional organic compound having two different functional groups, one of the functional groups reactive with the copper pad and the other of the functional groups not reactive with the copper pad;
- and
- a resin layer on the adhesion layer and the dielectric material with an opening formed through the resin layer exposing a portion of the copper pad.
Dependencies are inferred from the claim text.