Thin film capacitors for core and adjacent build up layers
AssigneeInternational Business Machines Corporation
InventorsCharles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Jean Audet, Francesco Preda
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorsCharles L. Arvin, Brian W. Quinlan, Charles L. Reynolds, Jean Audet, Francesco Preda
Estimating the term…
A device substrate includes a core material. A capacitor sheet can be affixed adjacent to a surface of the core material, where the capacitor sheet covers the surface of the core material. A first opening can extend through both capacitor sheet and the core material, where the first opening are larger than a substrate pass through-hole. An electrically inert material can fill the first opening. A second opening can extend parallel to the first opening through the electrically inert material, where the second opening is at least as large as the substrate pass through-hole and having sidewalls enclosed within the electrically inert material.
A device substrate, comprising:
Dependencies are inferred from the claim text.