Back to results
US 11,388,819 B2Granted
Wiring board, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorsTakuo Kisaki, Keisuke Sawada
Life of this patent
Estimating the term…
Abstract
A wiring board includes an insulating substrate, at least one external electrode disposed on a first surface of the insulating substrate, and wiring that is disposed in the insulating substrate and that is electrically connected to the at least one external electrode. The wiring includes a portion where an extension direction of the wiring is inclined relative to the first surface of the insulating substrate.
Claims23
A wiring board comprising:
- an insulating substrate;
- at least one external electrode disposed on a first surface of the insulating substrate;
- wiring that is disposed in the insulating substrate and that is electrically connected and physically connected to the at least one external electrode;
- and
- a via conductor that extends from a second surface opposite the first surface of the insulating substrate into the insulating substrate, wherein
- the wiring comprises a portion where an extension direction of the wiring is inclined relative to the first surface,
- the insulating substrate is made of ceramic,
- the wiring is composed of metalized wiring having a ribbon shape
- the portion of the wiring includes at least one end of the wiring so that the wiring extends from the first surface into the insulating substrate in an inclined direction relative to the first surface,
- the one end of the wiring is connected to the at least one external electrode on the first surface, and another end of the wiring is connected to the via conductor in the insulating substrate.
7 more elements
A wiring board comprising:
- an insulating substrate;
- a first electrode disposed on a first surface of the insulating substrate;
- first wiring disposed in the insulating substrate;
- and
- a via conductor disposed in the insulating substrate, wherein
- one end of the first wiring is connected to the first electrode on the first surface,
- another end of the first wiring is connected to the via conductor in the insulating substrate, and
- the first wiring comprises a portion where an extension direction of the first wiring is inclined relative to the first surface, the portion including the one end of the first wiring so that the first wiring extends from the first surface into the insulating substrate in an inclined direction relative to the first surface.
5 more elements
Dependencies are inferred from the claim text.