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US 11,388,506 B2Granted
Bone conduction earphones
AssigneeShenzhen Shokz Co., Ltd.
InventorsZhen Wang, Zhiqing Liu, Yonggen Wang, Xinnan Mao
Life of this patent
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Abstract
The present disclosure relates to a bone conduction earphone. The bone conduction earphone may include an ear hook assembly and a core module. The ear hook assembly may include an ear hook housing. The core module may be disposed on one end of the ear hook assembly. The core module may include a core housing and a core. An opening may be disposed on one end of the core housing to form a chamber structure for accommodating the core. An elastic modulus of the core housing may be greater than an elastic modulus of the ear hook housing.
Claims19
A bone conduction earphone, comprising:
- an ear hook assembly including an ear hook housing, wherein the ear hook housing includes an earphone fixing portion, a bending transition portion, and an accommodation bin which are sequentially connected;
- and
- a core module disposed on one end of the ear hook assembly, the core module including a core housing and a core, and an opening being disposed on one end of the core housing to form a chamber structure for accommodating the core;
- wherein
- an elastic modulus of the core housing is greater than an elastic modulus of the ear hook housing,
- the earphone fixing portion is disposed on an opening end of the core housing, and
- a reinforcing structure is disposed on the earphone fixing portion, wherein a ratio of a difference between a rigidity of a skin contact region of the core housing and a rigidity of the earphone fixing portion and the rigidity of the skin contact region of the core housing is less than or equal to 10%.
4 more elements
Dependencies are inferred from the claim text.