Photosensitive component, and camera module and manufacturing method therefor

A camera module, comprising:

• at least a photosensitive component comprising at least a circuit board, at least a photosensitive element, and at least an integrally encapsulated base, wherein said circuit board comprises at least a circuit board main body and has at least a disposing area arranged on said circuit board main body, wherein said photosensitive element is arranged on said disposing area, wherein said integrally encapsulated base comprises at least a base main body and has at least an optical window arranged thereon, wherein said base main body integrally encapsulates at least part of said photosensitive element and at least part of said circuit board main body, wherein said optical window provides a light path for said photosensitive element;
• and
• at least a lens, positioned along the photosensitive path of said photosensitive element;
• wherein said disposing area is a through hole, wherein said photosensitive element is arranged in the through hole, wherein said photosensitive element is electrically connected through at least an electrical connection element, and wherein said electrical connection element has two ends, respectively connected with said photosensitive element and a surface of said circuit board main body.

A molded circuit board member, comprising:

• at least a photosensitive element, wherein said photosensitive element comprises a photosensitive area and a non-photosensitive area arranged thereon;
• at least a circuit board, comprising at least an accommodating space provided therein, wherein said photosensitive element is accommodated in said accommodating space and communicatively connected with said circuit board;
• and
• at least a keeping portion, comprising at least an optical window formed thereon while integrally formed on said non-photosensitive area of said photosensitive element and said circuit board, wherein said photosensitive area of said photosensitive element corresponds to said optical window;
• wherein said accommodating space is a through hole, wherein said photosensitive element is arranged in the through hole, wherein said photosensitive element is electrically connected through at least an electrical connection element, and wherein said electrical connection element has two ends, respectively connected with said photosensitive element and a surface of said circuit board main body.