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US 11,388,277 B2Granted
Electronic device including interposer
AssigneeSamsung Electronics Co., Ltd.
InventorsTaewoo Kim, Dui Kang, Bongkyu Min, Bongchoon Park, Sanghoon Park, Jinyong Park, Hyelim Yun, Hyeongju Lee, Younoh Chi
Life of this patent
Estimating the term…
Abstract
An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
Claims20
An electronic device comprising:
- a first printed circuit board (PCB) including a first conductive terminal;
- a second PCB including a second conductive terminal;
- and
- an interposer including a dielectric substrate and a multi-conductive member that passes though the dielectric substrate and electrically connects the first conductive terminal of the first PCB and the second conductive terminal of the second PCB,
- wherein the multi-conductive member comprises:
- an insulation member;
- a first conductive member that is disposed inside the insulation member;
- a second conductive member disposed inside the insulation member and separated from the first conductive member;
- and
- a ground member disposed between the insulation member and the dielectric substrate, and
- wherein the first conductive member and the second conductive member respectively transmit a designated signal or a designated power to the first PCB or the second PCB.
8 more elements
An interposer, comprising:
- a dielectric substrate;
- and
- a multi-conductive member that passes though the dielectric substrate and electrically connects a first conductive terminal of a first printed circuit board (PCB) and a second conductive terminal of a second PCB, the multi-conductive member including:
- an insulation member;
- a first conductive member that is disposed inside the insulation member;
- a second conductive member disposed inside the insulation member and separated from the first conductive member;
- and
- a ground member disposed between the insulation member and the dielectric substrate,
- wherein the first conductive member and the second conductive member respectively transmit a designated signal or a designated power to the first PCB or the second PCB.
6 more elements
Dependencies are inferred from the claim text.