Camera module including heat dissipating structure and electronic device including the same

An electronic device comprising:

• a housing including:
• a frame structure configured to form a portion of a surface of the electronic device,
• a plate structure surrounded by the frame structure, the plate structure including a first opening,
• a metal portion containing a metallic material, and
• a polymer portion containing a polymer material;
• a support plate configured to face the plate structure, the support plate including a polymer area formed of a polymer material;
• a printed circuit board disposed between the plate structure and the support plate, the printed circuit board configured to make contact with part of the metal portion of the housing;
• a camera module disposed between a part of the polymer portion included in the plate structure and the polymer area included in the support plate, wherein the camera module includes a camera bracket disposed on the polymer area, a camera PCB disposed on the camera bracket, a light emitting unit, and a light receiving unit, the light emitting unit and light receiving unit disposed on the camera PCB;
• and
• a heat dissipating structure configured to transfer heat generated from the camera module to the metal portion included in the housing,
• wherein the heat dissipating structure includes a heat transfer member that is formed between the camera bracket and the polymer area and that extends between the printed circuit board and the support plate.