Radio frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorAtsushi Horita
Life of this patent
Estimating the term…
Abstract
A radio frequency module includes: a module substrate; a first circuit component disposed on a first principal surface of the module substrate; and a second circuit component stacked on the first circuit component. Here, one of the first circuit component and the second circuit component includes a reception filter, the other of the first circuit component and the second circuit component includes a switch connected between an antenna connection terminal and the reception filter, and the second circuit component is connected to the first circuit component via a via electrode in the first circuit component or a side wiring on a side surface of the first circuit component.
Claims20
A radio frequency module, comprising:
- a substrate including a first principal surface and a second principal surface opposing the first principal surface;
- a first circuit component disposed on the first principal surface;
- a second circuit component stacked on the first circuit component;
- and
- a third circuit component disposed on the second principal surface, wherein
- one of the first circuit component and the second circuit component includes a first filter,
- another of the first circuit component and the second circuit component includes a first switch connected between an antenna connection terminal and the first filter, and
- the second circuit component is connected to the first circuit component via a via electrode in the first circuit component or a side wiring on a side surface of the first circuit component.
A communication device, comprising:
- a signal processing circuit configured to process a radio frequency signal transmitted or received by an antenna;
- and
- a radio frequency module configured to transfer the radio frequency signal between the antenna and the signal processing circuit, wherein
- the radio frequency module comprises
- a substrate including a first principal surface and a second principal surface opposing the first principal surface;
- a first circuit component disposed on the first principal surface;
- a second circuit component stacked on the first circuit component;
- and
- a third circuit component disposed on the second principal surface, wherein
- one of the first circuit component and the second circuit component includes a first filter,
- another of the first circuit component and the second circuit component includes a first switch connected between an antenna connection terminal and the first filter, and
- the second circuit component is connected to the first circuit component via a via electrode in the first circuit component or a side wiring on a side surface of the first circuit component.
A radio frequency module, comprising:
- a substrate including a first principal surface and a second principal surface opposing the first principal surface;
- a first circuit component disposed on the first principal surface;
- a second circuit component stacked on the first circuit component;
- and
- a third circuit component disposed on the second principal surface, wherein
- one of the first circuit component and the second circuit component includes a first filter, and
- another of the first circuit component and the second circuit component includes a first switch connected between an antenna connection ten final and the first filter;
- and
- means for connecting the second circuit component to the first circuit component.
Dependencies are inferred from the claim text.