High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorsSyuichi Onodera, Takashi Watanabe
Life of this patent
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Abstract
A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.
Claims18
A high-frequency-module comprising:
- a substrate having a first mounting surface;
- a first laminated component disposed on the first mounting surface;
- a first wiring;
- a third integrated circuit;
- an acoustic wave filter;
- a first switch circuit disposed between an antenna element and the acoustic wave filter;
- a second switch circuit;
- an amplifier circuit disposed between the second switch circuit and the acoustic wave filter;
- and
- a matching circuit disposed between the acoustic wave filter and the amplifier circuit,
- wherein the first laminated component comprises:
- a first component, and
- a second component disposed on the first component,
- wherein the first component comprises:
- a first surface facing the first mounting surface,
- a second surface facing the first surface back to back, and
- a first connection terminal provided on the first surface,
- wherein the second component comprises:
- a third surface facing the second surface, and
- a second connection terminal provided on the third surface,
- wherein the first wiring is provided on the second surface and is connected to the second connection terminal,
- wherein at least a part of the first wiring is not covered by the second component,
- wherein the substrate comprises a second mounting surface facing the first mounting surface back to back,
- wherein the third integrated circuit is provided on the second mounting surface,
- wherein the acoustic wave filter, the first switch circuit, and the matching circuit are disposed on a side of the first mounting surface,
- wherein the acoustic wave filter is included in the first component or the second component, and
- wherein the amplifier circuit and the second switch circuit are included in the third integrated circuit.
Dependencies are inferred from the claim text.