Surface acoustic wave filter package structure and method of manufacturing the same

A surface acoustic wave filter package structure, comprising:

• a dielectric substrate, comprising:
• a dielectric layer, which has a first side and a second side, which is opposite to the first side;
• a first patterned conductive layer, which is arranged in the dielectric layer, and one surface of the first patterned conductive layer is exposed out of the first side of the dielectric layer;
• a second patterned conductive layer, which is arranged in the dielectric layer on the second side of the dielectric substrate, and at least has a conductive circuit portion, a conductive electrode portion and a finger electrode portion;
• and
• a conductive connection layer, which is arranged in the dielectric layer, and electrically connected to the first patterned conductive layer and the second patterned conductive layer;
• a chip having an active surface, which faces toward the second side of the dielectric substrate and corresponds to the finger electrode portion of the second patterned conductive layer;
• a polymer sealing frame, which is arranged between the chip and the dielectric substrate, and surrounded at a periphery of the chip to form a closed cavity with the chip and the dielectric substrate;
• and
• a mold sealing layer, which is arranged on the dielectric substrate and covers the chip and the polymer sealing frame, and the side of the polymer sealing frame is exposed out of the mold sealing layer.