Power driving chip and method thereof

A power driving method, comprising:

• disposing an integrated power module in a package structure, wherein the integrated power module comprises a transistor, and a gate driver electrically connected to the transistor;
• disposing a controller in a package structure, and electrically connecting the controller to the integrated power module;
• disposing a multi-level over-temperature protection circuit in a controller to measure an inner temperature of the controller;
• setting a first trigger temperature of the multi-level over-temperature protection circuit, wherein when the inner temperature exceeds the first trigger temperature, the multi-level over-temperature protection circuit generates a load-shedding driving signal to the controller, and the controller decreases output power of the integrated power module according to the load-shedding driving signal;
• and
• setting a second trigger temperature of the multi-level over-temperature protection circuit, wherein when the inner temperature exceeds the second trigger temperature, the multi-level over-temperature protection circuit generates an overloading driving signal to the controller, and the controller turns off the integrated power module according to the overloading driving signal;
• wherein the second trigger temperature is higher than the first trigger temperature, and the second trigger temperature is a maximum withstand temperature of the integrated power module, and the first trigger temperature is a maximum withstand temperature of the controller, and the controller is stacked on the integrated power module in the package structure.