Power semiconductor module with press-fit contact element
AssigneeSemikron Elektronik GmbH & Co. KG
InventorsIngo Bogen, Alexander Wehner
Life of this patent
Estimating the term…
Abstract
A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.
Claims17
A press-fit contact element, comprising:
- a press-fit portion, a compensating portion and a foot portion;
- the compensating portion being elastic in a longitudinal direction (z) of the press-fit contact element;
- the compensating portion having at least two O-shaped sub-portions that each have a respective recess;
- and
- at least a first constriction arranged in the longitudinal direction (z) between two successively arranged O-shaped sub-portions.
Dependencies are inferred from the claim text.