Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket device

A contact pin for a spring contact, the contact pin comprising:

• a plate-shaped body part having a predetermined width and a predetermined thickness;
• a head part configured to be integrated with an upper end of the body part;
• and
• a leg part formed by extending from a lower end of the body part to be integrated therewith,
• wherein the head part is a plate-shaped strip provided on the upper end of the body part, wherein the strip has the same length at each of opposite sides of the body part relative thereto and has an upper tip part formed along an upper end of the strip, the strip comprising:
• a first strip section provided to be located on the same plane as a plane of the body part and to have the same distance from a center of the body part to each of the opposite sides thereof, and a second strip section formed by being rolled at each of opposite end parts of the first strip section to have a semicircular shape, wherein the first strip section is located in a diameter direction of a cylindrical shape formed by an entirety of the second strip sections;
• the body part has a groove formed at the center of each of opposite surfaces of the body part by being recessed in a longitudinal direction of the body part, wherein a stepped holding step is formed on a lower end part of the groove, and an upper end of the groove is formed to be open by extending up to an upper end of the first strip section;
• and
• the leg part is configured as a pair of leg parts formed by extending from the body part such that the leg parts have a first width therebetween and are horizontally symmetrical to each other, wherein each of the leg parts comprises:
• a hook protrusion formed by protruding inward from each of end parts of the leg parts, the hook protrusions having a second width therebetween smaller than the first width;
• and a lower tip part formed by protruding from a lower end of the leg part.