Semiconductor package with plastic waveguide
AssigneeInfineon Technologies AG
InventorsMaciej Wojnowski, Dirk Hammerschmidt, Walter Hartner, Johannes Lodermeyer, Chiara Mariotti, Thorsten Meyer
Life of this patent
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Abstract
A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.
Claims24
A semiconductor device, comprising:
- an Integrated Circuit (IC) package, comprising:
- a semiconductor chip;
- and
- an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna;
- and
- a plastic waveguide attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package,
- wherein the plastic waveguide is arranged at least partially within the IC package.
An Integrated Circuit (IC) package, comprising:
- a semiconductor chip;
- an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna;
- and
- a plastic waveguide fastener,
- wherein when a plastic waveguide is fastened to the IC package by the plastic waveguide fastener, the plastic waveguide is configured to transport the RF signal between the embedded antenna and outside of the IC package.
Dependencies are inferred from the claim text.