Methods for integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites
AssigneeSkyworks Solutions, Inc.
InventorsDavid Bowie Cruickshank, David Martin Firor, Iain Alexander MacFarlane
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Abstract
Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.
Claims18
A method of forming an electronic device including a co-fired circulator, the method comprising:
- preparing a ferrite disc;
- preparing a dielectric substrate, the dielectric substrate having an aperture;
- translating the ferrite disc into the aperture in the dielectric substrate to form a composite structure;
- co-firing the composite structure to shrink the dielectric substrate around the ferrite disc to form the circulator;
- metallizing the co-fired composite structure;
- mounting a packaged semiconductor transistor-based amplifier and a packaged bulk acoustic wave or surface acoustic wave filter on the dielectric substrate;
- and
- connecting the packaged amplifier to a first port of the circulator and connecting the packaged filter to a second port of the circulator.
A method of forming a radio frequency antenna system, the method comprising:
- preparing a ferrite disc;
- preparing a dielectric substrate, the dielectric substrate having an aperture;
- translating the ferrite disc into the aperture in the dielectric substrate to form a composite structure;
- co-firing the composite structure to shrink the dielectric substrate around the ferrite disc to form a circulator;
- metallizing the co-fired composite structure;
- printing a coupler on the dielectric substrate;
- placing a packaged semiconductor transistor-based amplifier and a packaged bulk acoustic wave or surface acoustic wave filter on the dielectric substrate;
- coupling the packaged amplifier to the coupler;
- and
- connecting the packaged amplifier to a first port of the circulator and connecting the packaged filter to a second port of the circulator.
Dependencies are inferred from the claim text.