Organic electroluminescent display panel including selectively oxidized protection layer and method for manufacturing the same

A method for manufacturing an organic electroluminescent display panel, comprising:

• forming a first electrode, a pixel defining layer, an organic light emitting functional layer and a second electrode on a substrate, the pixel defining layer being provided between any adjacent pixel regions and surrounding each of the pixel regions;
• forming a conductive film on the second electrode;
• and
• performing an oxidation process on the conductive film to form a conductive layer and a protection layer, wherein the conductive layer is provided at a side of the pixel defining layer away from the substrate, the conductive layer and the protection layer are provided in a single layer, a surface of the protection layer away from the substrate is parallel to a surface of the second electrode away from the substrate, the conductive layer is provided between the protection layer and the second electrode, and the conductive layer is in contact with the second electrode, the protection layer comprises a first portion provided in the pixel regions and a second portion provided on the conductive layer, and in a direction perpendicular to the substrate, a sum of a thickness of the second portion and a thickness of the conductive layer is approximately equal to a thickness of the first portion,
• wherein a material of the conductive layer includes a metal or a metal alloy, and a material of the protection layer includes an oxide of the metal or an oxide of the metal alloy,
• wherein the performing the oxidation process on the conductive film to form the conductive layer and the protection layer comprises:
• forming a mask pattern layer on the conductive film, the mask pattern layer being located at the side of the pixel defining layer away from the substrate;
• performing a first oxidation process on the conductive film to form the first portion of the protection layer;
• and
• removing the mask pattern layer, and performing a second oxidation process on the conductive film to form the second portion of the protection layer and the conductive layer, and
• wherein an oxidation intensity of the first oxidation process is larger than that of the second oxidation process.