Electronic module with sealing resin

An electronic module comprising:

• a substrate that includes a first main surface and a second main surface;
• electrodes that are provided on the second main surface of the substrate;
• at least one first electronic component that includes electrodes provided on a mounting surface thereof on the substrate and that includes a hollow portion;
• at least one second electronic component that includes electrodes provided on a mounting surface thereof on the substrate and that includes no hollow portion;
• and
• a sealing resin;
• wherein
• the at least one first electronic component is mounted on the first main surface of the substrate and sealed with the sealing resin;
• the at least one second electronic component has a narrowest pitch between the electrodes provided on the mounting surface thereof when compared with any other second electronic components, and is mounted on the second main surface of the substrate;
• and
• the electrodes provided on the second main surface of the substrate and the electrodes of the at least one second electronic component that join the at least one second electronic component to the substrate are not sealed with sealing resin.