Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrate
AssigneeSemiLEDS Optoelectronics Co., Ltd.
InventorsDavid Trung Doan, Trung Tri Doan
Life of this patent
Estimating the term…
Abstract
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
Claims16
A method for making light emitting device LED arrays comprising:
- providing a plurality of separate LEDs;
- providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the LEDs and the temporary substrate configured as an attaching substrate for attaching the LEDs to the support substrate;
- attaching the LEDs to the temporary substrate;
- forming one or more insulator layers on the LEDs while attached to the temporary substrate;
- forming one or more metal layers configured to electrically connect the LEDs to form a desired circuitry;
- and
- separating the LEDs along with the metal layers and the insulator layers from the carrier substrate and the temporary substrate.
A method for making light emitting device LED arrays comprising:
- providing a plurality of separate LEDs, each LED comprising a bare LED die, a packaged LED or an optical device having a desired configuration;
- providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the LEDs and the temporary substrate configured as an attaching substrate for attaching the LEDs to the support substrate, wherein the temporary substrate and the carrier substrate are combined into one substrate;
- attaching the LEDs to the temporary substrate;
- forming one or more insulator layers on the LEDs attached to the temporary substrate;
- forming one or more metal layers on the insulator layers configured to electrically connect the LEDs to form a desired circuitry;
- and
- separating the LEDs along with the metal layers and the insulator layers from the carrier substrate and the temporary substrate.
A method for making light emitting device LED arrays comprising:
- providing a plurality of separate LEDs, each LED having a desired configuration with extended pads;
- providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the LEDs and the temporary substrate configured as an attaching substrate for attaching the LEDs to the support substrate;
- attaching the LEDs to the temporary substrate;
- forming a plurality of metal posts on the temporary substrate in electrical contact with the LEDs and encapsulating the metal posts in an insulator layer;
- and
- separating the LEDs along with the metal posts and the insulator layer from the carrier substrate and the temporary substrate.
Dependencies are inferred from the claim text.