Display apparatus using semiconductor light emitting device
AssigneeLG Electronics Inc.
InventorByungjoon Rhee
Life of this patent
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Abstract
Discussed is a display apparatus and, more particularly, to a display apparatus using a semiconductor light emitting device. A display apparatus includes a substrate having a first wiring; a rib portion provided with a first rib and a second rib formed to protrude from one surface of the substrate, the first and second ribs disposed on opposite sides of the first wiring; a solderable metal filled between the first rib and the second rib, and formed to cover the first wiring; and a plurality of semiconductor light emitting devices sequentially arranged along the rib portion, at least part of the plurality of semiconductor light emitting devices are inserted into the solderable metal to be electrically connected to the first wiring.
Claims20
A display apparatus, comprising:
- a substrate having a first wiring;
- a rib portion provided with a first rib and a second rib formed to protrude from one surface of the substrate, the first and second ribs disposed on opposite sides of the first wiring;
- a solderable metal filled between the first rib and the second rib, and formed to cover the first wiring;
- a plurality of semiconductor light emitting devices sequentially arranged along the rib portion;
- and
- a planarizing layer formed to cover the solderable metal,
- wherein at least part of the plurality of semiconductor light emitting devices are inserted into the solderable metal to be electrically connected to the first wiring,
- wherein the planarizing layer is formed to cover a top of the rib portion and the solderable metal, and
- wherein a top of the planarizing layer is formed with a flat surface.
A display apparatus, comprising:
- a substrate having a plurality of first wirings;
- a plurality of ribs extending on one surface of the substrate, at least two ribs among the plurality of ribs arranged between adjacent first wirings, and at least two ribs among the plurality of ribs arranged on opposite sides of one first wiring among the plurality of first wirings;
- a solderable metal filled between the at least two ribs arranged on opposites sides of the one first wiring and covering the one first wiring;
- a plurality of semiconductor light emitting devices sequentially arranged along the one first wiring and within the solderable metal;
- and
- a planarizing layer formed to cover the solderable metal,
- wherein the planarizing layer is formed to cover a top of the at least two ribs and the solderable metal, and
- wherein a top of the planarizing layer is formed with a flat surface.
Dependencies are inferred from the claim text.