Method of transferring light emitting device for display and display apparatus

A method of transferring a light emitting device, comprising:

• preparing a wafer including a substrate, semiconductor layers disposed on the substrate, and bump pads disposed on the semiconductor layers and arranged in a plurality of light emitting device regions;
• dividing the wafer into a plurality of light emitting devices while the light emitting devices are in close contact with each other;
• attaching the light emitting devices to a transfer tape disposed on a supporting substrate, such that the substrate contacts the transfer tape, wherein attaching the light emitting devices to the transfer tape comprises:
• transferring the light emitting devices attached on a breaking tape to a temporary substrate while the light emitting devices are in close contact with each other;
• and
• transferring the light emitting devices to the transfer tape from the temporary substrate;
• preparing a circuit board including pads arranged thereon;
• adjoining the supporting substrate with the circuit board, so that the bump pads of at least one light emitting device contact the pads of the circuit board;
• bonding the at least one light emitting device to the pads by applying heat to the bump pads and the pads;
• and
• separating the at least one light emitting device bonded to the pads from the transfer tape.