Optoelectronic package assemblies including solder reflow compatible fiber array units and methods for assembling the same

A method for assembling an optoelectronic package assembly, the method comprising:

• engaging a connector holder with a substrate, the connector holder defining an engagement feature and the substrate comprising optical waveguides;
• engaging a connector of a fiber array unit with the engagement feature of the connector holder, wherein the engagement feature retains the connector, and wherein the fiber array unit further comprises optical fibers coupled to the connector;
• optically coupling the optical fibers to the optical waveguides of the substrate such that there is a lateral alignment between the optical fibers and the optical waveguides;
• heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate by exposing the connector holder, the fiber array unit, the substrate, and the solder to temperatures between about 240 degrees Celsius and 270 degrees Celsius;
• and
• cooling the solder to couple the substrate to the base substrate, wherein the lateral alignment between the optical fibers and the optical waveguides changes by less than 1.0 micrometer following the heating and cooling steps.