Low drain-source on resistance semiconductor component and method of fabrication

A method of attaching a semiconductor component to a secondary structure comprising:

• providing a device wafer, the device wafer including a substrate having a major surface and a minor surface opposite the major surface, a plurality of semiconductor die areas at the major surface, a plurality of active devices located at the plurality of semiconductor die areas, and streets around peripheries of the semiconductor die areas;
• forming a eutectic alloy composition at the minor surface of the substrate, the eutectic alloy composition having a first thickness;
• partially removing the eutectic alloy composition from the minor surface of the substrate such that a second thickness of the eutectic alloy composition remains on the minor surface, the second thickness being less than the first thickness;
• depositing a bonding layer over the eutectic alloy composition;
• separating the plurality of the semiconductor die areas at the streets to produce a plurality of semiconductor components each having the bonding layer, the semiconductor component being one of the plurality of semiconductor components;
• and
• utilizing the bonding layer to attach the semiconductor component to the secondary structure.