Semiconductor device and method for manufacturing the same
AssigneeDynax Semiconductor, Inc.
InventorsNaiqian Zhang, Xi Song, Qingzhao Gu, Xingxing Wu
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AssigneeDynax Semiconductor, Inc.
InventorsNaiqian Zhang, Xi Song, Qingzhao Gu, Xingxing Wu
Estimating the term…
The present disclosure provides a semiconductor device and a method for manufacturing the same, and it relates to a field of semiconductor technology. The semiconductor device includes a substrate, a semiconductor layer, a dielectric layer, a source, a drain, and a gate, wherein a first face of the gate close to a side of the drain and close to the semiconductor layer has a first curved face. A gate trench corresponding to the gate is provided on the dielectric layer, a material of the gate being filled in the gate trench, and at least a part of a second face of the gate trench in contact with the gate is a second curved face which extends from a surface of the dielectric layer away from the semiconductor layer toward the semiconductor layer.
A semiconductor device comprising:
A method for manufacturing a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.