Optical sensor with trench etched through dielectric over silicon
AssigneeTexas Instruments Incorporated
InventorsScott Robert Summerfelt, Hassan Omar Ali, Benjamin Stassen Cook
Life of this patent
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Abstract
In described examples an integrated circuit (IC) has multiple layers of dielectric material overlying at least a portion of a surface of a substrate. A trench is etched through the layers of dielectric material to expose a portion the substrate to form a trench floor, the trench being surrounded by a trench wall formed by the layers of dielectric material. A metal perimeter band surrounds the trench adjacent the trench wall, the perimeter band being embedded in one of the layers of the dielectric material.
Claims16
An integrated circuit (IC) comprising:
- a substrate having a first surface and an opposite second surface;
- layers of dielectric material overlying at least a portion of the first surface;
- a trench through the layers of dielectric material, the trench extending to a trench floor at the first surface, and the trench surrounded by the layers of dielectric material that form a trench wall;
- a metal perimeter band in at least one of the layers of dielectric material, the metal perimeter band surrounding the trench adjacent the trench wall;
- and
- an optical sensor in the substrate at the first surface adjacent the trench.
An integrated circuit (IC) comprising:
- a substrate having a first surface and an opposite second surface;
- layers of dielectric material overlying at least a portion of the first surface;
- a trench through the layers of dielectric material, the trench extending to a trench floor at the first surface, and the trench surrounded by the layers of dielectric material that form a trench wall;
- a metal perimeter band in at least one of the layers of dielectric material, the metal perimeter band surrounding the trench adjacent the trench wall;
- and
- a polymer filter material within the trench.
An integrated circuit (IC) comprising:
- a substrate having a first surface and an opposite second surface;
- layers of dielectric material overlying at least a portion of the first surface;
- a sensor in the substrate at the first surface;
- a backside trench in the substrate, the backside trench extending from the second surface to a backside trench floor at the sensor, and the backside trench surrounded by the substrate that forms a backside trench wall;
- and
- an anti-reflective coating on the backside trench floor and the backside trench wall.
Dependencies are inferred from the claim text.