Image sensor package including reflector
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDo Jae Yoo, Byoung Heon Kim, Yong Gil Namgung, Jong Cheol Hong, Si Joong Yang
Life of this patent
Estimating the term…
Abstract
An image sensor package includes a substrate, an image sensor mounted on the substrate, a bonding wire connecting the image sensor to the substrate, a reflector disposed on the image sensor, a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member including a hole exposing an effective imaging plane of the image sensor, and a filter attached to the sealing member.
Claims22
An image sensor package comprising:
- a substrate;
- an image sensor mounted on the substrate;
- a bonding wire connecting the image sensor to the substrate;
- a reflector disposed on the image sensor and configured to reflect light away from the image sensor;
- a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member comprising a hole exposing an effective imaging plane of the image sensor;
- and
- a filter attached to the sealing member,
- wherein at least a portion of an upper surface of the reflector is exposed by the hole of the sealing member, and
- the sealing member comprises an inner side surface extending from the upper surface of the reflector and forming the hole that exposes the effective imaging plane of the image sensor and at least the portion of the upper surface of the reflector.
An image sensor package comprising:
- a substrate;
- an electronic component mounted on the substrate;
- an image sensor mounted on the substrate;
- a bonding wire connecting the image sensor to the substrate;
- a reflector disposed on the substrate and configured to reflect light away from the image sensor;
- a sealing member sealing the electronic component, and covering at least a portion of the reflector, the sealing member comprising a hole exposing the image sensor;
- and
- a filter attached to the sealing member,
- wherein at least a portion of an upper surface of the reflector is exposed by the hole of the sealing member, and
- the sealing member comprises an inner side surface extending from the upper surface of the reflector and forming the hole that exposes the image sensor and at least the portion of the upper surface of the reflector.
An image sensor package comprising:
- a substrate;
- an electronic component mounted on the substrate;
- an image sensor mounted on the substrate;
- a bonding wire connecting the image sensor to the substrate;
- a reflector disposed on the image sensor or the substrate and configured to reflect light away from the image sensor or the substrate;
- a sealing member sealing the electronic component and covering only a portion of the reflector, the sealing member comprising a hole exposing an effective imaging plane of the image sensor and a portion of the reflector that is not covered by the sealing member;
- and
- a filter attached to the sealing member and covering the hole in the sealing member,
- wherein the portion of the reflector that is not covered by the sealing member and is exposed by the hole comprises at least a portion of an upper surface of the reflector, and
- the sealing member comprises an inner side surface extending from the upper surface of the reflector and forming the hole that exposes the effective imaging plane of the image sensor and the portion of the reflector that is not covered by the sealing member.
Dependencies are inferred from the claim text.