Sensors having an active surface
AssigneeIllumina, Inc.
InventorsArvin Emadi, Arnaud Rival, Ali Agah
Life of this patent
Estimating the term…
Abstract
Disclosed in one example is an apparatus including a substrate, a sensor over the substrate including an active surface and a sensor bond pad, a molding layer over the substrate and covering sides of the sensor, the molding layer having a molding height relative to a top surface of the substrate that is greater than a height of the active surface of the sensor relative to the top surface of the substrate, and a lidding layer over the molding layer and over the active surface. The lidding layer and the molding layer form a space over the active surface of the sensor that defines a flow channel.
Claims16
An apparatus, comprising:
- a substrate having a substrate bond pad;
- a sensor over the substrate, the sensor comprising an active surface and a sensor bond pad;
- a molding layer over the substrate and covering sides of the sensor, the molding layer having a molding height extending vertically from a top surface of the substrate, the molding height being greater than a height of the active surface of the sensor, wherein the height of the active surface of the sensor extends vertically from the top surface of the substrate;
- and
- a lidding layer over a sufficiently planar upper surface of the molding layer and over the active surface;
- wherein the lidding layer and the molding layer collectively form a space over the active surface of the sensor, the space defining a flow channel.
An apparatus, comprising:
- a sensor over a substrate, the sensor comprising an active surface and a sensor bond pad;
- a through-silicon via (TSV) extending through the sensor and electrically connecting the sensor bond pad to a redistribution layer (RDL) over a bottom surface of the sensor, the RDL in electrical contact with a substrate bond pad;
- a molding layer over the substrate and covering sides of the sensor, the molding layer having a molding height extending vertically from a top surface of the substrate, the molding height being substantially equal to the height of the active surface of the sensor, wherein the height of the active surface of the sensor extends vertically from the top surface of the substrate;
- an interposer layer over the molding layer;
- a through-silicon via (TSV) in electrical contact with the substrate bond pad, the TSV extending through the substrate;
- and
- a lidding layer on the interposer layer and over the active surface;
- wherein the lidding layer and the interposer layer collectively form a space over the active surface of the sensor that defines a flow channel.
Dependencies are inferred from the claim text.