Array substrate and display device

A method of manufacturing an array substrate, comprising:

• preparing a base substrate comprising a display region and a non-display region at a periphery of the display region;
• forming a plurality of pixel structures in the display region;
• forming a driving circuit on the base substrate, the driving circuit being configured to drive a thin film transistor of the pixel structure in the display region;
• forming an insulating layer on a side of the driving circuit distal to the base substrate such that the insulating layer has a concave-convex structure;
• forming an outgoing line on a side of the insulating layer distal to the base substrate, such that the outgoing line extends from each of the pixel structures in the display region, and overlaps and is connected to a connection line in an overlapping and connection region of the non-display region, wherein
• an area of a contact interface of the connection line and the outgoing line is larger than an area of an orthographic projection of the contact interface on the base substrate,
• the method further comprises forming an auxiliary connection line between the connection line and the outgoing line in the overlapping and connection regions, such that extension directions of the auxiliary connection line, the connection line and the outgoing line are the same, and an orthographic projection of each of the auxiliary connection line, the connection line and the outgoing line overlaps an orthographic projection of each of the other two of the auxiliary connection line, the connection line and the outgoing line,
• the auxiliary connection line in the overlapping and connection region has a stacked structure including indium tin oxide and silver,
• the connection line in the overlapping and connection region has a stacked structure in which titanium, aluminum, and titanium are sequentially stacked,
• the outgoing line is made of an alloy containing magnesium and silver, and
• the connection line is formed on a side of the insulating layer distal to the base substrate, such that the connection line in the overlapping and connection region has a concave-convex structure, and
• the auxiliary connection line is formed such that the auxiliary connection line in the overlapping and connection region has a lower surface with a concave-convex structure matched with the concave-convex structure of the connection line and an upper surface with a concave-convex structure,
• the outgoing line is formed on a side of the auxiliary connection line distal to the base substrate, such that the outgoing line has a lower surface with a concave-convex structure matched with the concave eons ex structure on the upper surface of the auxiliary connection line and an upper surface which is a flat surface without concave and convex structure.