System in package structure for perform electrostatic discharge operation and electrostatic discharge protection structure thereof

An electrostatic discharge protection structure, coupled to at least one integrated circuit disposed in an encapsulating material, comprising:

• a redistribution layer, disposed outside the encapsulating material, opposite to the at least one integrated circuit, having multilayer dielectric layers and multilayer conductive layers alternately stacked between the at least one integrated circuit and a substrate, and coupled to the at least one integrated circuit, the redistribution layer having a first electrode and a second electrode;
• and
• a first transistor array, disposed outside the encapsulating material and the at least one integrated circuit and coupled to a pin end of the at least one integrated circuit, the first electrode and the second electrode, the first transistor array having a plurality of transistors, a plurality of first transistors of the transistors coupled in parallel, and a plurality of second transistors of the transistors coupled in parallel, the first transistors and the second transistors configured to be turned on for dissipating an electrostatic discharge current,
• wherein the first transistor array, the first electrode and the second electrode are disposed in one of the multilayer conductive layers, respectively,
• wherein the arrangement of the transistors is a plurality of transistor strings, the transistor strings are respectively coupled to the pin end by a plurality of wires, wherein the wires respectively provide a plurality of transmission delay, which are the same.