US 11,387,226 B2Granted

Chip power supply system, chip, PCB, and computer device

AssigneeHuawei Technologies Co., Ltd.

InventorsYadong Bai, Zhijun Qu, Changxing Sun, Haitao Han

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Abstract

This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.

Claims20

Dependent claims

A chip power supply system, comprising:

a first printed circuit board (PCB);
a chip;
a power controller;
and
an inductor module, wherein
the first PCB comprises N vias, first ends of the N vias are located at a top layer of the first PCB, and second ends of the N vias are located at a bottom layer of the first PCB, and N is an integer that is greater than 1;
a bottom surface of the chip is provided with N power supply contacts, and the chip is coupled to the top layer of the first PCB through the N power supply contacts and the first ends of the N vias;
a bottom surface of the inductor module is provided with M power supply contacts, and the inductor module is coupled to the chip through the M power supply contacts and the second ends of M vias, wherein the M vias are part of the N vias, and M is equal to or less than N, and
the power controller is coupled to the inductor module through the first PCB, wherein the power controller is configured to control the inductor module to supply power to the chip.

6 more elements

A computer device, comprising:

a chip power supply system, wherein the chip power supply system comprises a first printed circuit board (PCB), a chip, a power controller, and an inductor module, wherein
the first PCB comprises N vias, first ends of the N vias are located at a top layer of the first PCB, and second ends of the N vias are located at a bottom layer of the first PCB, and N is an integer that is greater than 1;
a bottom surface of the chip is provided with N power supply contacts, and the chip is coupled to the top layer of the first PCB through the N power supply contacts and the first ends of the N vias;
a bottom surface of the inductor module is provided with M power supply contacts, and the inductor module is coupled to the chip through the M power supply contacts and the second ends of M vias, wherein the M vias are part of the N vias, and M is equal to or less than N, and
the power controller is coupled to the inductor module through the first PCB, wherein the power controller is configured to control the inductor module to supply power to the chip.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/090,510Filed 5 Nov 2020
Priority: CN 201911088701.48 Nov 2019
Published: US 2021/0143141 A113 May 2021
Granted: 12 Jul 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

H10W 70/685
Shapes or dispositions thereof: comprising multiple insulating layers
H10W 90/00
Package configurations
H02M 3/003
Conversion of DC power input into DC power output: constructional details, e.g. physical layout, assembly, wiring or busbar connections
H02M 3/1584
Including plural semiconductor devices as final control devices for a single load: with a plurality of power processing stages connected in parallel