Phase change material in substrate cavity
AssigneeIntel Corporation
InventorsCheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan M Jha, Ying Wang, Kyu-oh Lee
Life of this patent
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Abstract
A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.
Claims20
A semiconductor device package structure comprising:
- a substrate having a cavity;
- phase change material within the cavity, the phase change material having a phase change temperature lower than 120 degrees centigrade;
- a die coupled to the substrate;
- and
- one or more interconnect structures to couple the die to the phase change material within the cavity.
A system comprising:
- a substrate having a cavity;
- a die coupled to the substrate;
- a power supply to supply power to the die;
- phase change material within the cavity, the phase change material having a phase change temperature lower than 200 degrees centigrade;
- first one or more interconnect structures to couple the die to the phase change material within the cavity;
- and
- second one or more interconnect structures to couple the phase change material within the cavity to a circuit board to which the substrate is attached.
A method comprising:
- receiving a substrate;
- forming a cavity within the substrate;
- depositing material having phase change properties within the cavity, the material having a phase change temperature less than 120 degrees centigrade;
- forming an interconnect structure that is coupled to the material;
- and
- coupling a die to the substrate, such that the die is coupled to the material by the interconnect structure.
Dependencies are inferred from the claim text.