High density pixelated LED and devices and methods thereof
AssigneeCreeLED, Inc.
InventorsJohn Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
Life of this patent
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AssigneeCreeLED, Inc.
InventorsJohn Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
Estimating the term…
At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
A pixelated-LED chip comprising:
A method for fabricating a solid-state lighting device, the method comprising:
Dependencies are inferred from the claim text.