Method of transferring a plurality of micro light emitting diodes to a target substrate, array substrate and display apparatus thereof
AssigneeBoe Technology Group Co., Ltd.
InventorsGuan Huang, Yijie Huo, Fang Liu
Life of this patent
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Abstract
The present application discloses a method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate. The method includes providing a first substrate having an array of the plurality of micro LEDs; providing a target substrate having a bonding layer having a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate.
Claims15
A method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate, comprising:
- providing a first substrate having an array of the plurality of micro LEDs;
- providing a target substrate having a bonding layer comprising a plurality of bonding contacts;
- applying the plurality of bonding contacts with an electrical potential;
- aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential;
- and
- transferring the plurality of micro LEDs in the first substrate onto the target substrate;
- wherein each of the plurality of micro LEDs comprises a micro p-n diode and a metallization block on the micro p-n diode;
- and
- aligning the plurality of micro LEDs with the plurality of bonding contacts comprises aligning the metallization block with one of the plurality of bonding contacts applied with the electrical potential, the metallization block is placed between the micro p-n diode and one of the plurality of bonding contacts;
- wherein aligning the plurality of micro LEDs with the plurality of bonding contacts comprises:
- placing the first substrate and the target substrate so that the first substrate and the target substrate face each other;
- and
- moving the first substrate and the target substrate toward each other;
- wherein applying the plurality of bonding contacts with the electrical potential is performed during moving the first substrate and the target substrate toward each other.
A method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate, comprising:
- providing a first substrate having an array of the plurality of micro LEDs;
- providing a target substrate having a bonding layer comprising a plurality of bonding contacts;
- applying the plurality of bonding contacts with an electrical potential;
- aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential;
- and
- transferring the plurality of micro LEDs in the first substrate onto the target substrate:
- wherein applying the plurality of bonding contacts with the electrical potential comprises applying the electrical potential to a signal line commonly connected to the plurality of bonding contacts;
- wherein the target substrate comprises an array of a plurality of thin film transistors, each of which comprising a drain electrode electrically connected to one of the plurality of bonding contacts, a source electrode electrically connected to a common electrode, and a gate electrode;
- wherein applying the electrical potential to the signal line commonly connected to the plurality of bonding contacts comprises:
- applying a plurality of gate scanning signals respectively to a plurality of gate electrodes of the plurality of thin film transistors to turn on the plurality of thin film transistors;
- and
- applying the electrical potential to the common electrode electrically connected to a plurality of source electrode of the plurality of thin film transistors thereby applying the electrical potential to the plurality of bonding contacts.
Dependencies are inferred from the claim text.