Bonding apparatus and bonding method

A bonding method for bonding an electronic component using a bonding apparatus, the bonding apparatus bonding the electronic component, which has an electrode surface provided with a plurality of electrode portions, to a substrate or another electronic component by thermo-compression, with a thermo-compression film attached to the electrode surface being interposed therebetween, the bonding apparatus comprising:

• a stage that has a placing surface on which the electronic component is placed, with the thermo-compression film being interposed therebetween;
• and
• a bonding tool which detachably holds a main surface of the electronic component that is placed on the stage, the main surface being on a reverse side of the electrode surface,
• wherein the stage has a push-up unit which applies, to the electrode surface of the electronic component, a force for separating the electronic component therefrom in a normal direction of the placing surface, the bonding method comprising:
• a step of placing the electronic component on the stage that has the placing surface on which the electronic component is placed, with the thermo-compression film being interposed therebetween;
• and
• a step of holding the electronic component by using the bonding tool which detachably holds the main surface of the electronic component that is placed on the stage, the main surface being on the reverse side of the electrode surface,
• wherein the step of holding the electronic component includes
• a step of separating the electronic component from the stage by applying the force to the electrode surface in the normal direction of the placing surface, and
• a step of holding, by the bonding tool, the electronic component separated from the stage.