Semiconductor module and manufacturing method therefor
AssigneeFuji Electric Co., Ltd.
InventorsTakafumi Yamada, Hiromichi Gohara
Life of this patent
Estimating the term…
Abstract
A semiconductor module is provided, including: a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to the upper surface electrode; a metal wiring plate electrically connected to the upper surface electrode of the semiconductor chip; and a sheet-like low elastic sheet provided on the metal wiring plate, the low elastic sheet having elastic modulus lower than that of the metal wiring plate. A manufacturing method for a semiconductor module is provided, including: providing a semiconductor chip; solder-bonding a metal wiring plate above said semiconductor chip; and applying a sheet-like low elastic sheet having the elastic modulus lower than that of said metal wiring plate to said metal wiring plate.
Claims12
A semiconductor module comprising:
- a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to said upper surface electrode;
- a metal wiring plate electrically connected to said upper surface electrode of said semiconductor chip, the metal wiring plate having an elastic modulus;
- a low elastic modulus sheet provided on said metal wiring plate, said low elastic modulus sheet having an elastic modulus lower than that of said metal wiring plate;
- a solder portion bonding said upper surface electrode of said semiconductor chip and said metal wiring plate;
- and
- a sealing resin sealing said semiconductor chip and said metal wiring plate;
- wherein said sealing resin is in contact with said solder portion,
- wherein said metal wiring plate has an upper surface,
- wherein said metal wiring plate includes:
- a bonding portion solder-bonded by the solder portion to said upper surface electrode of said semiconductor chip;
- and
- a rising portion connected to said bonding portion and extended in a direction away from said semiconductor chip,
- wherein the upper surface of said metal wiring plate is entirely provided with said low elastic modulus sheet thereon including said low elastic modulus sheet being provided on both of said bonding portion and said rising portion.
A semiconductor module comprising:
- a semiconductor chip having an upper surface electrode and a lower surface electrode opposite to said upper surface electrode;
- a metal wiring plate electrically connected to said upper surface electrode of said semiconductor chip, the metal wiring plate having an elastic modulus,
- wherein said metal wiring plate includes:
- a bonding portion for providing bonding to said upper surface electrode of said semiconductor chip;
- and
- a rising portion connected to said bonding portion and extended in a direction away from said semiconductor chip;
- a low elastic modulus sheet provided on said metal wiring plate, said low elastic modulus sheet having an elastic modulus lower than that of said metal wiring plate;
- a solder portion for bonding said upper surface electrode of said semiconductor chip and said metal wiring plate;
- and
- a sealing resin sealing said semiconductor chip and said metal wiring plate,
- wherein said bonding portion is solder-bonded by said solder portion to said upper surface electrode of said semiconductor chip,
- wherein said low elastic modulus sheet is provided to protrude out of an interface with said metal wiring plate at an end portion of said bonding portion,
- wherein said sealing resin is in contact with a side surface of said bonding portion of said metal wiring plate that is farthest from the rising portion, and
- wherein the low elastic modulus sheet is spaced apart from the solder portion.
Dependencies are inferred from the claim text.