Semiconductor die connection system and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Fa Chen, Chen-Hua Yu, Sen-Bor Jan
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Abstract
A system and method for connecting semiconductor dies is provided. An embodiment comprises connecting a first semiconductor die with a first width to a second semiconductor die with a larger second width and that is still connected to a semiconductor wafer. The first semiconductor die is encapsulated after it is connected, and the encapsulant and first semiconductor die are thinned to expose a through substrate via within the first semiconductor die. The second semiconductor die is singulated from the semiconductor wafer, and the combined first semiconductor die and second semiconductor die are then connected to another substrate.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- bonding a first semiconductor device and a second semiconductor device to a first wafer, the first semiconductor device having a semiconductor substrate, a through substrate via extending partially through the semiconductor substrate;
- placing an encapsulant between the first semiconductor device and the second semiconductor device;
- polishing the encapsulant, the first semiconductor device, and the second semiconductor device until an end of the through substrate via is exposed;
- and
- sawing through the encapsulant and the first wafer.
A method of manufacturing a semiconductor device, the method comprising:
- bonding a first semiconductor device to a first wafer;
- bonding a second semiconductor device to the first wafer, the second semiconductor device being separated from the first semiconductor device by a first distance;
- encapsulating the first semiconductor device and the second semiconductor device with an encapsulant;
- exposing a through substrate via within the first semiconductor device using a planarization process, the planarization process also removing a first portion of the encapsulant and a second portion of the second semiconductor device;
- and
- forming an opening through both the encapsulant and the first wafer, the opening being located between the first semiconductor device and the second semiconductor device and the opening having a first width less than the first distance.
A method of manufacturing a semiconductor device, the method comprising:
- placing an encapsulant over a first semiconductor device and around a second semiconductor device, wherein the encapsulant extends away from the second semiconductor device to be planar with a sidewall of the first semiconductor device;
- removing top portions of the encapsulant, the first semiconductor device, and the second semiconductor device using a polishing process;
- sawing the encapsulant and the first semiconductor device after the placing the encapsulant;
- and
- sandwiching the second semiconductor device between a printed circuit board and the first semiconductor device, the printed circuit board having a first width, the first semiconductor device having a second width, and the second semiconductor device having a third width less than both the first width and the second width.
Dependencies are inferred from the claim text.