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US 11,387,203 B2Granted
Side wettable package
AssigneePanjit International Inc.
InventorsChung-Hsiung Ho, Chi-Hsueh Li
Life of this patent
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Abstract
A side wettable package includes a molding compound, a chip and multiple conductive pads exposed from a bottom surface of the molding compound. The conductive pads include peripheral conductive pads arranged near a side wall of the molding compound. Each of the peripheral conductive pads is over etched to form an undercut. When the side wettable package is connected to a circuit board via solder, the solder ascends to the undercut of the peripheral conductive pads for improving connection yield and facilitating inspection of soldering quality.
Claims4
A side wettable package comprising:
- a molding compound having a bottom surface and a side wall;
- a chip encapsulated in the molding compound;
- a plurality of conductive pads electrically connected to the chip with each conductive pad being partially embedded in the molding compound and exposed from the bottom surface of the molding compound;
- wherein the plurality of conductive pads comprises multiple peripheral conductive pads distributed near the side wall of the molding compound, and each of the peripheral conductive pads has a side surface and forms an undercut on the side surface;
- wherein each undercut has a concave surface curved inward relative to the side wall of the molding compound and having a height equal to a thickness of the peripheral conductive pads;
- and
- a protection cover being formed to cover each of the conductive pads exposed from the bottom surface of the molding compound and the concave surface of each undercut.
4 more elements
Dependencies are inferred from the claim text.