Chip package and manufacturing method thereof

A manufacturing method of a chip package, comprising:

• forming an antenna layer on a top surface of a supporting element;
• bonding the supporting element to a top surface of a semiconductor substrate, wherein the top surface of the semiconductor has a conductive pad and the top surface of the supporting element faces away from the semiconductor substrate;
• disposing a protective layer on the supporting element and the antenna layer, wherein the protective layer is made of a material that comprises glass, fused silica, silica glass, sapphire, or combinations thereof;
• etching a bottom surface of the semiconductor substrate such that the semiconductor substrate has an inclined sidewall, and the conductive pad protrudes from the inclined sidewall;
• performing a cutting process such that the supporting element has an inclined sidewall adjacent to the top surface of the supporting element;
• and
• forming a redistribution layer on the inclined sidewall of the supporting element such that the redistribution layer is in contact with a sidewall of the conductive pad and an end of the antenna layer,
• wherein the protective layer covers the supporting element, the antenna layer, and an end of the redistribution layer facing away from the semiconductor substrate.

A chip package, comprising:

• a first substrate having a first surface and a second surface opposite to the first surface;
• an antenna layer located on the first surface of the first substrate;
• a first passivation layer covering the antenna layer;
• and
• a redistribution layer located on the second surface of the first substrate, and electrically connected to the antenna layer, wherein the redistribution layer further has a shielding section spaced apart from the antenna layer, and the shielding section overlaps the antenna layer.

A manufacturing method of a chip package, comprising:

• forming an antenna layer on a first surface of a first substrate, wherein the first substrate has a second surface opposite to the first surface;
• forming a first passivation layer covering the antenna layer;
• and
• forming a redistribution layer on the second surface of the first substrate, wherein the redistribution layer is electrically connected to the antenna layer, the redistribution layer has a shielding section spaced apart from the antenna layer, and the shielding section overlaps the antenna layer.