Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
AssigneeIntel Corporation
InventorsGeorgios C. Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair
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Abstract
Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.
Claims20
A computing device comprising:
- at least one processor to process data;
- and
- a communication module or chip coupled to the at least one processor, wherein the communication module or chip comprises:
- a first die comprising silicon;
- a first overmolded component having a second die coupled to the first die, the second die having devices or circuitry formed with compound semiconductor materials in a different substrate, wherein the first die is not entirely within a footprint of the first overmolded component;
- and
- an antenna unit coupled to the second die.
A computing device comprising:
- at least one processor to process data;
- and
- a communication module or chip coupled to the at least one processor, wherein the communication module or chip comprises:
- a first die comprising silicon, the first die on a surface of a first side of the communication module or chip;
- a plurality of external connections on the surface of the first side of the communication module or chip, wherein the first die is laterally adjacent to the plurality of external connections;
- a first overmolded component having a second die coupled to the first die, the second die having devices or circuitry formed with compound semiconductor materials in a different substrate, wherein the first die is not entirely within a footprint of the first overmolded component;
- and
- an antenna unit coupled to the second die, the antenna unit for transmitting and receiving communications.
A computing device comprising:
- at least one processor to process data;
- and
- a communication module or chip coupled to the at least one processor, wherein the communication module or chip comprises:
- a first die comprising silicon, the first die on a surface of a first side of the communication module or chip;
- a first overmolded component having a second die coupled to the first die, the second die having devices or circuitry formed with compound semiconductor materials in a different substrate, the first overmolded component on a surface of a second side of the communication module or chip, the second side opposite the first side, wherein the first die is not entirely within a footprint of the first overmolded component;
- and
- an antenna unit coupled to the second die, the antenna unit for transmitting and receiving communications.
Dependencies are inferred from the claim text.