US 11,387,198 B2 · Device, system and method for providing inductor structures

Abstract

Techniques and mechanisms for providing an inductor with an integrated circuit (IC) die. In an embodiment, the IC die comprises integrated circuitry and one or more first metallization layers. The IC die is configured to couple to a circuit device including one or more second metallization layers, where such coupling results in the formation of an inductor which is coupled to the integrated circuitry. One or more loop structures of the inductor each span both some or all of the one or more first metallization layers and some or all of the one or more second metallization layers. In another embodiment, the IC die or the circuit device includes a ferromagnetic material to concentrate a magnetic flux which is provided with the inductor.

Claims15

Dependent claims

A system comprising:

a first integrated circuit (IC) die including:
a semiconductor substrate and first integrated circuitry;
and
one or more first metallization layers coupled between the first integrated circuitry and a hardware interface;
and
a second circuit device coupled to the first IC die, the second circuit device including one or more second metallization layers coupled to the one or more first metallization layers via the hardware interface;
wherein the system includes an inductor coupled to the first integrated circuitry, wherein one or more loop structures of the inductor each include:
a respective first conductor portion of the one or more first metallization layers;
and
a respective second conductor portion of one or more second metallization layers of the second circuit device, the respective second conductor portion coupled to the first conductor portion.

7 more elements

Dependencies are inferred from the claim text.

Device, system and method for providing inductor structures

Life of this patent

Device, system and method for providing inductor structures

Life of this patent

Abstract

Claims15