Electronic chip
AssigneeSTMicroelectronics (Crolles 2) SAS
InventorSebastien Petitdidier
Life of this patent
Estimating the term…
Abstract
An electronic chip includes a substrate made of semiconductor material. Conductive pads are located on a front side of the substrate and cavities extend into the substrate from a backside of the substrate. Each cavity reaches an associated conductive pad. Protrusions are disposed on the backside of the substrate. A conductive layer covers the walls and bottoms of the cavities. The conductive layer includes portions on the backside, each portion partially located on an associated protrusion and electrically connecting two of the conductive pads.
Claims20
A method of manufacturing an electronic chip, the method comprising:
- having a semiconductor substrate made of semiconductor material;
- disposing an integrated circuitry at a front-side of the semiconductor substrate;
- disposing a plurality of conductive pads at the front-side of the semiconductor substrate;
- etching a plurality of cavities at a backside of the semiconductor substrate, each cavity vertically aligned directly below and reaching an associated conductive pad, the cavities defining non-planar portions of the backside of the semiconductor substrate;
- covering walls and bottoms of the cavities using a conductive layer, portions of the conductive layer overlying the non-planar portions of the backside, each portion electrically connecting two of the conductive pads;
- and
- depositing an insulating material on the cavities and covering the conductive layer and the backside of the semiconductor substrate.
A method of manufacturing an electronic chip, the method comprising:
- having a substrate made of semiconductor material;
- disposing a plurality of conductive pads on a front-side of the substrate;
- etching a plurality of cavities in the substrate from a backside of the substrate, each cavity vertically aligned directly below and reaching an associated conductive pad, the cavities defining portions of the substrate;
- disposing a plurality of protrusions on the backside of the substrate, each protrusion disposed on an associated portion of the substrate, each protrusion made of the same semiconductor material as the semiconductor material of the substrate;
- covering walls and bottoms of the cavities using a conductive layer, the conductive layer comprising portions on the backside, each portion partially located on an associated protrusion and electrically connecting two of the conductive pads;
- and
- disposing a detection circuit at the front-side of the substrate, the detection circuit configured to detect a variation of an electric characteristic measured between electrically connected conductive pads.
A method of manufacturing an electronic chip, the method comprising:
- forming conductive pads on a front-side of a semiconductor substrate;
- etching cavities from a backside of the semiconductor substrate, each cavity opposite an associated conductive pad;
- etching the backside of the semiconductor substrate until the cavities reach the associated conductive pads and forming protrusions between cavities;
- covering the backside of the semiconductor substrate with a conductive layer;
- and
- etching the conductive layer to form portions, each portion extending between two cavities and partially located on a protrusion.
Dependencies are inferred from the claim text.