Method of making moisture barrier for bond pads and integrated circuit having the same
AssigneeSkyworks Solutions, Inc.
InventorsJiro Yota, Shiban Kishan Tiku
Life of this patent
Estimating the term…
Abstract
A semiconductor die includes a substrate layer, one or more metal layers disposed over the substrate layer, and a pair of polyimide layers disposed over the substrate so that they define an interface therebetween. One or both of the pair of polyimide layers have a trench that separates the interface from the one or more metal layers. The trench can be formed by etching the polyimide layer(s). A topcoat insulation layer is disposed over the one or more metal layers and polyimide layers. The topcoat insulation layer is impervious to moisture and the trench inhibits migration of moisture along the interface to the one or more metal layers, thereby preventing metal migration from the one or more metal layers along the interface.
Claims20
A method of making a semiconductor die, the method comprising:
- forming or providing a substrate layer;
- forming or applying one or more metal layers over the substrate layer;
- forming or applying a first polymer interlevel dielectric layer over the substrate layer and forming or applying a second polymer interlevel dielectric layer over the first polymer interlevel dielectric layer to define an interface therebetween, at least a portion of the first and second polymer interlevel dielectric layers being adjacent at least one of the one or more metal layers;
- forming a trench in the one or both of the first and second polymer interlevel dielectric layers and filling the trench such that the interface between the first and second polymer interlevel dielectric layers is separated from the one or more metal layers;
- and
- forming or applying a topcoat insulation layer over the one or more metal layers and first and second polymer interlevel dielectric layers, the topcoat insulation layer being impervious to moisture, the trench inhibiting migration of moisture along the interface to the one or more metal layers, thereby preventing metal migration from the one or more metal layers along the interface.
A method of making a radiofrequency module, the method comprising:
- forming or providing a printed circuit board that includes a substrate layer;
- forming or providing a semiconductor die comprising (a) forming or providing a substrate layer, (b) forming or applying one or more metal layers over the substrate layer, (c) forming or applying a first polymer interlevel dielectric layer over the substrate layer and forming or applying a second polymer interlevel dielectric layer over the first polymer interlevel dielectric layer to define an interface therebetween, at least a portion of the first and second polymer interlevel dielectric layers being adjacent at least one of the one or more metal layers, (d) forming a trench in the one or both of the first and second polymer interlevel dielectric layers and filling the trench such that the interface between the first and second polymer interlevel dielectric layers is separated from the one or more metal layers, and (e) forming or applying a topcoat insulation layer over the one or more metal layers and first and second polymer interlevel dielectric layers, the topcoat insulation layer being impervious to moisture, the trench inhibiting migration of moisture along the interface to the one or more metal layers, thereby preventing metal migration from the one or more metal layers along the interface;
- and
- mounting the semiconductor die on the printed circuit board.
Dependencies are inferred from the claim text.