Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation

A method comprising:

• providing a double-sided package having a plurality of modules, wherein:
• an inter-module area is in between two adjacent modules of the plurality of modules;
• each of the plurality of modules comprises a module substrate, at least one electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, and a plurality of module contacts formed at a bottom surface of the module substrate and encapsulated by a second mold compound;
• and
• the module substrate comprises at least one grounded conductive element, wherein the at least one grounded conductive element is positioned at a periphery of the module substrate, such that the at least one grounded conductive element is adjacent to an edge of a corresponding inter-module area;
• sub-dicing the double-sided package with a first blade at each inter-module area to create an elongated cavity, wherein:
• the double-sided package is sub-diced from a top surface of the double-sided package toward a bottom surface of the double-sided package;
• the elongated cavity extends vertically from the top surface of the double-sided package toward the bottom surface of the double-sided package without extending completely through the second mold compound, such that a portion of the second mold compound remains underneath the elongated cavity;
• and
• the at least one grounded conductive element associated with each of the plurality of modules is exposed to a corresponding elongated cavity;
• applying a shielding structure completely over the top surface of the double-sided package and exposed faces within each elongated cavity to form a shielded electronic package, wherein the shielding structure is in contact with the at least one grounded conductive element associated with each of the plurality of modules;
• and
• singulating the shielded electronic package into a plurality of shielded electronic modules by dicing with a second blade from the remaining portion of the second mold compound under the elongated cavity until reaching the bottom of each elongated cavity, wherein the second blade is wider than the first blade.