Embedded very high density (VHD) layer
AssigneeIntel Corporation
InventorsAndrew Paul Collins, Jianyong Xie, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov
Life of this patent
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Abstract
Embodiments may relate to an interposer that has a first layer with a plurality of first layer pads that may couple with a die. The interposer may further include a second layer with a power delivery component. The interposer may further include a very high density (VHD) layer, that has a VHD pad coupled by a first via with the power delivery component and coupled by a second via with a first layer pad. Other embodiments may be described and/or claimed.
Claims25
An interposer comprising:
- a first layer with a plurality of first layer pads, wherein a first first layer pad of the plurality of first layer pads is to couple with a first die;
- a second layer with a power delivery component;
- and
- a very high density (VHD) layer, wherein the VHD layer includes a first VHD pad and a second VHD pad of a plurality of VHD pads of the VHD layer, and wherein the first VHD pad is coupled by a first via with the power delivery component and not coupled by a via with the plurality of first layer pads, and the second VHD pad is coupled by a second via with the first first layer pad and not coupled by a via with the power delivery component.
A substrate comprising:
- a first build-up (BU) layer with a plurality of first layer pads;
- a second BU layer with a power delivery component;
- and
- a very high density (VHD) layer with a plurality of VHD pads, the VHD layer positioned between the first BU layer and the second BU layer, wherein the VHD layer includes:
- a first VHD pad of the plurality of VHD pads that is communicatively coupled with a first first layer pad of the plurality of first layer pads by a first via, wherein the first VHD pad is not communicatively coupled by a via to the power delivery component;
- and
- a second VHD pad of the plurality of VHD pads that is communicatively coupled with a second first layer pad of the plurality of first layer pads by a second via and is coupled with the first VHD pad by a first VHD trace, and wherein the second VHD pad is not communicatively coupled by a via to the power delivery component.
A method of forming an interposer that includes a very high density (VHD) layer, the method comprising:
- forming a second build-up (BU) layer with a power delivery component;
- forming, on the second BU layer, the VHD layer, wherein the VHD layer includes a plurality of VHD pads and a first VHD pad of the plurality of VHD pads is coupled with a second VHD pad of the plurality of VHD pads by a first VHD trace, wherein the first and second VHD pads are not coupled to the power delivery component;
- and
- forming, on the VHD layer, a first BU layer such that the VHD layer is positioned between the first BU layer and the second BU layer.
A computing system comprising:
- a substrate that includes a first build-up (BU) layer, a second BU layer with a power delivery component, and a very high density (VHD) layer positioned between the first BU layer and the second BU layer;
- a first die coupled with a first first layer pad of a plurality of first layer pads of the first BU layer;
- and
- a second die coupled with a second first layer pad of the plurality of first layer pads;
- wherein the first first layer pad is coupled with a first VHD pad of a plurality of VHD pads of the VHD layer by a first via and the first VHD pad is not coupled by a via with the power delivery component;
- the second first layer pad is coupled with a second VHD pad of the plurality of VHD pads by a second via and the second VHD pad is not coupled by a via to the power delivery component;
- and
- the first VHD pad is coupled with the second VHD pad by a first VHD trace.
Dependencies are inferred from the claim text.