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US 11,387,186 B2Granted
Fan-out package with rabbet
AssigneeRockley Photonics Limited
InventorsSeungjae Lee, Brett Sawyer, Chia-Te Chou
Life of this patent
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Abstract
A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.
Claims27
A system, comprising:
- a fan-out package, comprising:
- a first semiconductor die;
- a mold compound, covering the first semiconductor die on at least two sides;
- and
- an electrical contact, on a lower surface of the first semiconductor die,
- the fan-out package having a rabbet along a portion of a lower edge of the fan-out package, the rabbet being spaced apart from the first semiconductor die in a plan view,
- wherein the system further comprises a second semiconductor die in the rabbet, the second semiconductor die extending beyond an end of the rabbet in the plan view.
4 more elements
A method for fabricating a fan-out package of, the fan-out package comprising:
- a first semiconductor die;
- a mold compound, covering the first semiconductor die on at least two sides;
- and
- an electrical contact, on a lower surface of the first semiconductor die,
- the fan-out package having a rabbet along a portion of a lower edge of the fan-out package, and
- the method comprising:
- fabricating a carrier comprising:
- a layer of the mold compound;
- a plurality of semiconductor dies comprising the first semiconductor die, embedded in the mold compound;
- and
- a redistribution layer, on the semiconductor dies and the mold compound;
- cutting a first channel into the carrier, the first channel having a first width and a first depth, and extending between the first semiconductor die and a second semiconductor die of the plurality of semiconductor dies;
- and
- cutting a second channel into the carrier, within the first channel, the second channel having a second width less than the first width and a second depth, from an upper surface of the carrier, greater than the first depth.
11 more elements
A system, comprising:
- a fan-out package, comprising:
- a first semiconductor die;
- a mold compound, covering the first semiconductor die on at least two sides;
- an electrical contact, on a lower surface of the first semiconductor die;
- and
- a redistribution layer directly on the lower surface of the first semiconductor die,
- the fan-out package having a rabbet along a portion of a lower edge of the fan-out package, and
- an edge surface of the redistribution layer forming a portion of the rabbet.
5 more elements
A system, comprising:
- a fan-out package, comprising:
- a first semiconductor die,
- a mold compound, covering the first semiconductor die on at least two sides,
- an electrical contact, on a lower surface of the first semiconductor die, and
- a redistribution layer on a lower surface of the fan-out package;
- a second semiconductor die;
- a shared support element;
- and
- a layer of underfill between the redistribution layer and the shared support element and extending to the second semiconductor die,
- the fan-out package having a rabbet along a portion of a lower edge of the fan-out package.
7 more elements
Dependencies are inferred from the claim text.