Semiconductor package having a semiconductor device bonded to a circuit substrate through connection terminals and dummy conductors and method of manufacturing the same

A semiconductor package, comprising:

• an integrated circuit;
• a plurality of connecting terminals disposed on and electrically connected to the integrated circuit;
• a plurality of dummy conductors disposed on and electrically isolated from the integrated circuit;
• and
• a redistribution layer circuit structure comprising a plurality of first conductive pads, a plurality of second conductive pads each separated from the plurality of first conductive pads, and a solder mask layer with a plurality of first recesses and a plurality of second recesses defined therein,
• wherein the integrated circuit is bonded to the redistribution layer circuit structure through connecting the plurality of connecting terminals to the plurality of first conductive pads and connecting the plurality of dummy conductors to the plurality of second conductive pads,
• wherein there is a level difference between horizontal interfaces of the plurality of connecting terminals and the redistribution layer circuit structure and horizontal interfaces of the plurality of dummy conductors and the redistribution layer circuit structure, and
• wherein the plurality of second conductive pads each are exposed by a respective one of the plurality of second recesses and each are spaced apart from a sidewall of the corresponding one of the plurality of second recesses, and a sidewall of each of the plurality of second conductive pads is covered by a respective one of the plurality of dummy conductors connected thereto, wherein the plurality of dummy conductors are electrically floated or grounded.

A method of manufacturing a semiconductor package, comprising:

• providing a circuit structure having a plurality of first conductive pads, a plurality of second conductive pads each separated from the plurality of first conductive pads, and a solder mask layer having a plurality of first recesses and a plurality of second recesses formed therein, wherein each of the plurality of second conductive pads is within and exposed by a corresponding one of the plurality of second recesses and is spaced apart from a sidewall thereof, and each of the plurality of first conductive pads is in a corresponding one of the plurality of first recesses;
• providing a semiconductor device comprising an integrated circuit having a plurality of connecting pads, a plurality of connecting terminals disposed on the plurality of connecting pads and at least one dummy conductor disposed on and electrically isolated from the integrated circuit;
• and
• mounting the semiconductor device to the circuit structure by connecting the plurality of connecting terminals to the plurality of first conductive pads and connecting the at least one dummy conductor to one of the plurality of second conductive pads, wherein there is a level difference between horizontal interfaces of the plurality of connecting terminals and the plurality of first conductive pads and a horizontal interface of the at least one dummy conductor and the one of the plurality of second conductive pads along a stacking direction of the semiconductor device and the circuit structure, and a sidewall of the one of the plurality of second conductive pads is covered by the at least one dummy conductor, wherein the at least one dummy conductor is electrically floated or grounded.