Power module including a carrier assembly with combination of circuit board and lead frame
AssigneeNiko Semiconductor Co., Ltd.
InventorsChung-Ming Leng, Chih-Cheng Hsieh
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AssigneeNiko Semiconductor Co., Ltd.
InventorsChung-Ming Leng, Chih-Cheng Hsieh
Estimating the term…
A power module including a carrier assembly and a power device disposed on the carrier assembly is provided. The carrier assembly includes a bottom board, a circuit board, a lead frame, and a pad group. The circuit board is disposed on the bottom board and includes a device mounting portion and an extending portion protruding from a side of the device mounting portion. The lead frame disposed on the bottom board includes a first conductive portion and a second conductive portion insulated from each other. The extending portion of the circuit board is disposed between the first and second conductive portions, and an upper surface of the lead frame is flush with a top surface of the extending portion. A pad group includes a first pad disposed on the extending portion, a second pad and a third pad respectively disposed on the first and second conductive portions.
A power module, comprising:
A power module, comprising:
Dependencies are inferred from the claim text.